Solder mask


The protective mask covers the whole PCB surface except for the pads, on which either electronic components will be assembled, or the pads should remain uncovered for some other reason. The minimum spacing between the photo mask and a pad is 0.1 mm, or 0.3mm if epoxy or UV mask is applied. Vias are filled in by epoxy mask (for example when the PCB is fixed by vacuum before testing after assembly). The below pictures shows the conditions, under which the vias can be filled in: 

On filling vias in, the min. Spacing between a via and its adjacent pad should be min 0.30 mm.


Standard SET solder masks:

Protective Photo-masks (PETERS)

TypeCharacteristics


Colour:

ELPEMER SD2467SM-DG
dark green

ELPEMER SD2467SM-YG
light green (yellow-green)

ELPEMER SD2497SM-SG
white

ELPEMER SD2457SM-SM
blue

ELPEMER SD2447SM-SM
black

ELPEMER SD2437SM-DG
red


Standard:
IPC-SM-840C, Class H and T

Hardness
7H

Permittivity
93kV/mm

Surface resistance
1014W.cm

Internal resistance
1016 W.cm
Taiyo PSR-4000 LEW1(US) 0.8 KG 
White

Epoxy mask (PETERS) 

TypeCharacteristics

SD2468 NB-M/21
Colour:
green

Standard
IPC-SM-840C Class H

Permittivity
111kV/mm

Surface resistance
1014 W.cm

Adhesion to Cu
very good

Adhesion to Sn/Pb
very good

Resistance to HAL
very good

Protection during wave-soldering
excellent
SD2494 NB-SM
Colour:
green

Standard
IPC-SM-840C, Class H

Permittivity
111kV/mm

Surface resistance
1014 W.cm

Adhesion to Cu
very good

Adhesion to Sn/Pb
very good

Resistance to HAL
very good

Protection during wave-soldering
very good

UV mask (PETERS) 

TypeCharacteristics

SD2368 UV-SM-DG
Colour:
green

Standard
IPC-SM-840C, Class H

Permittivity
103kV/mm

Surface resistance
1014 W.cm

Adhesion to Cu
excellent

Adhesion to Sn/Pb
very good

Resistance to HAL
very good

Protection during wave-soldering
excellent